Quantum technologies are opening a new era, and Fraunhofer ENAS plays a key role in the development of related fabrication technologies.
Technologies based on the principles of quantum physics are the key to groundbreaking innovations in sensor technology, computer technology, and communication. They enable the development of sensors with significantly improved performance, achieve a multiple of computing power through parallel information processing, and create secure communication channels.
Quantum technologies enable the development of sensors with higher precision and sensitivity. This allows for the detection of magnetic fields or gravitational fields with unprecedented accuracy.
Similarly, quantum technologies promise significant advantages in the computer sector. By utilizing quantum chips as additional processing cores, quantum computers can solve a multitude of tasks simultaneously, providing enormous computing power.
Another significant aspect of quantum technologies lies in the creation of secure communication channels. By harnessing quantum effects, such as entangled photons, communication channels can be established that are secure against eavesdropping attempts.
For more than 20 years, quantum effects have been studied in research laboratories. Now is the time to translate this knowledge into technical reality by using suitable micro and nanotechnologies and material developments. First products, such as highly sensitive sensors, are already available on the market. Quantum computers with a small number of qubits, which are the smallest computational and information units of a quantum computer, are also being commercially utilized. An international race for dominance in this groundbreaking field has begun.
Micro and nanotechnologies, core competences of Fraunhofer ENAS, are the key to scaling, mass production, and realization of quantum technologies. In this field, we offer the following technologies and expertise:
- Technologies for wafer processing with specialized deposition and structuring processes that meet the requirements of quantum technologies, e.g., nanostructured crossbar arrays.
- Packaging technologies for the realization of complex and highly integrated quantum chips, e.g., ion traps.
- Integration of aspects of thermomechanical reliability under cryogenic conditions down to temperatures of a few millikelvin (mK).
- Manufacturing and utilization of micro and nanostructured optical components, e.g., metalenses and photonic integrated circuits.